ICT FLOATING PROBE TESTING
FOR ELECTRONIC BOARDS
The floating probe In-Circuit Test (ICT) represents an advanced and extremely flexible solution for testing electronic boards. This type of test allows you to verify the quality and functionality of a circuit without the need to create a dedicated jig, making it particularly advantageous for the production of small batches, prototypes and boards with complex layouts.
WHAT DOES THE ICT FLOATING PROBE TEST CONSIST OF?
The ICT flying probe test uses an automated system with moving contact tips that touch test points on the circuit board. The system analyzes parameters such as resistance, capacitance, inductance and continuity of the circuits, as well as detecting any short circuits, defective components or assembly errors. Thanks to the precision and high level of automation, it is possible to quickly identify faults or anomalies in the production process.
ADVANTAGES OF ICT FLOATING PROBE TESTING
- Test Flexibility: Does not require the creation of a fixed physical interface (bed-of-nails), reducing costs and setup times, especially for low-volume or variable production.
- Speed of Implementation: The system can be programmed and adapted quickly to new projects, facilitating the validation of prototypes and small series.
- Lower Initial Costs: Compared to traditional ICT tests, the absence of fixtures significantly reduces the initial investment.
- High Analysis Precision: Allows you to perform detailed and localized measurements, also detecting faults that may escape other types of tests.
- Non-Invasive: Thanks to the controlled contact technology, it avoids possible damage to the most delicate components of the board.
- Suitable for Complex Designs: Ideal for boards with high component density or layouts that are difficult to test with conventional methods.
The ICT flying probe test is therefore a versatile and effective solution to ensure the quality of electronic boards, improving production control and reducing the risk of failures in the final devices.
