RESINATION

RESIN TREATMENT FOR ELECTRONIC BOARDS

The resin treatment, also known as encapsulation or potting, is an essential process for the protection of electronic boards in critical environments. This technique consists of completely or partially covering the electronic circuits with an insulating resin, creating a protective barrier against external agents and mechanical stresses.

WHAT DOES RESINATION CONSIST OF?

The resin coating process involves pouring a polymer resin (epoxy, polyurethane or silicone) into a container or directly onto the electronic board. Once solidified, the resin forms a protective layer that seals the components and circuits, improving their reliability and durability over time.

ADVANTAGES OF RESIN COATING ON ELECTRONIC BOARDS

  1. Protection from External Agents: The resin prevents the entry of humidity, dust, chemicals and other contaminants that could compromise the functioning of the card.
  2. Electrical Isolation: Improves insulation between circuit traces, reducing the risk of short circuits and interference.
  3. Vibration and Shock Resistance: Protects electronic components from mechanical damage, making the board more resistant to physical stress and vibration.
  4. Improved Thermal Dissipation: Some resins are designed to aid in heat dissipation, helping to maintain optimal operating temperatures.
  5. Increased Lifespan and Reliability: Thanks to complete protection, the electronic board suffers less degradation over time, increasing its reliability and durability.
  6. Treatment Customization: Available in different formulations, the resin coating can be adapted to specific protection and application needs.

Thanks to resin coating, electronic boards can be used in extreme environments, ensuring high performance and long-lasting protection. This treatment is ideal for industrial, automotive, aerospace and many other applications where safety and resistance are essential.

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